摘要
为了研究胶焊工艺对接头力学性能的影响,并分析胶焊接头的温度场演变规律,针对1.5mm厚的SPCC冷轧钢薄板,开展胶接点焊和电阻点焊的正交试验,并应用极差和方差分析得到最佳工艺参数,借助材料性能试验机对两种接头进行单向静拉伸试验获得接头的失效载荷,对比分析点焊和胶焊接头的力学性能,建立胶焊接头的仿真模型,分析接头熔核区温度场的演变规律,采用超声波C扫描成像检测熔核直径。结果表明,影响胶焊接头拉剪载荷的主、次因素依次为焊接电流、焊接时间、电极压力;胶焊接头和点焊接头的平均失效载荷分别为11 071.12和10 179.72N,胶层的引入提高了接头的失效载荷;随着焊接时间的增加,熔融的金属液增多,熔核沿着径向和轴向呈椭圆形扩张,熔核中心的径向温度均高于轴向温度,模拟获得的熔核尺寸与超声C扫描测得熔核直径分别为6.17、5.61mm。
In order to study the influence of the weld bonding process on the mechanical properties and the evolution of temperature field of the weld-bonded joints,the orthogonal test of weld bonding and resistance spot welding was carried out for 1. 5 mm thick SPCC cold-rolled steel sheet. The optimum process parameters were obtained by using range and variance analysis. The two type joints were tested in the proper test machine to obtain the failure load of the joints. The mechanical properties of the spot welding and weld-bonded joints were compared and analyzed. In order to investigate the evolution of temperature field for weld-bonded joints, the weld bonding simulation models were established. The diameter of the nugget was measured by the C-scan image. The results show that the influence factors on the tensile load of the weld-bonded joints are as follows:the welding current,the welding time and the electrode pressure. The maximum average failure loads of weld-bonded joints and spot welding joints are 11 071. 12 and 10 179. 72 N,and the adhesive improves the shear strength of the joint. The volume of molten metal increases with the welding time extension,and the nugget expands elliptically along the radial and axial directions. The radial temperature is higher than the axial direction. Furthermore,the nugget diameter of simulation and C-scan image is 6. 17 and 5. 61 mm.
作者
易金权
曾凯
邢保英
吴万平
翟停停
YI Jin-quan;ZENG Kai;XING Bao-ying;WU Wan-ping;ZHAI Ting-ting(Faculty of Mechanical and Electrical Engineering,Kunming University of Science and Technology,Kunming 650500,Yunnan,China)
出处
《钢铁》
CAS
CSCD
北大核心
2019年第7期93-97,113,共6页
Iron and Steel
基金
国家自然科学基金资助项目(51565022)
关键词
胶接点焊
正交试验
仿真模型
C扫描像
spot weld bonding
orthogonal test
simulation model
C scan image
