摘要
为分析层压过程中不同槽型结构挠性基板对光纤应力应变的影响,采用COMSOL软件对光纤埋入不同槽型(U形、梯形、矩形)挠性基板的层压工艺进行仿真,分析槽型结构尺寸对光纤偏移量的影响,得到最优槽型结构。仿真结果表明,光纤埋入矩形槽挠性基板可降低光纤在层压过程产生的偏移量,且最优的矩形槽槽型结构的宽度与深度分别为125、145μm,此时光纤最大应力和最大偏移量分别为19.89MPa、2.0403μm。
In order to analyze the influence of different grooved structure flexible substrates on the stress and strain of the fiber under the lamination process, the COMSOL software was used to simulate the lamination process of the fiber embedded in different groove type (U-shaped, trapezoidal, rectangular) flexible substrates. The influence of the size of the structure on the fiber offset gives the optimal slot structure. The results show that the fiber embedded in the rectangular groove flexible substrate can reduce the offset of the fiber during the lamination process, and the width and depth of the optimal rectangular slot structure are 125 and 145 μm, respectively. The maximum stress and maximum offset of the fiber at this time are 19.89 MPa and 2.0403 μm, respectively.
作者
夏安思
周德俭
佘雨来
XIA Ansi;ZHOU Dejian;SHE Yulai(School of Mechatronic Engineering,Guilin University of Electronic Technology,Guilin 541004,China)
出处
《桂林电子科技大学学报》
2019年第2期108-112,共5页
Journal of Guilin University of Electronic Technology
基金
国家自然科学基金(51765013)
广西自然科学基金(2017GXNSFBA198180)
广西制造系统和先进制造技术重点实验室基金(1725905004Z)
关键词
挠性光电印制板
光纤埋入结构
层压工艺
应力应变
flexible optoelectronic printed board
fiber embedded structure
lamination process
stress strain
