摘要
随着元器件安装技术的发展,其对挠性印制电路板平整性的要求也越来越高。文章依据有限元分析方法,采用ANSYS软件对挠性板的两种层压工艺进行三维模型仿真,仿真结果表明与传统层压工艺相比,采用快速层压工艺可以有效地避免和降低挠性板翘曲问题的发生,提高挠性板的质量,增加电子产品的可靠性。
With the development of assembly technology of electronic components, the improvement of the assembly technology increases the requirements of the flatness of flexible printed circuit board（FPC）. In this paper, ANSYS software based on finite element method was employed to simulate the three-dimensional model of FPC during two different laminating process. The results showed that unlike the traditional laminating process, the fast laminating process could avoid and reduce FPC warping problems effectively, which could also improve the quality of FPC and increase the reliability of electronic products.
出处
《印制电路信息》
2012年第12期57-59,70,共4页
Printed Circuit Information
基金
广东省产学研项目资助:2011A090200017
关键词
挠性板
层压
有限元
平整性
FPC
Lamination
Finite Element Method
Flatness
