摘要
研究了微量Zn颗粒对Sn-0.7Cu钎料焊点微观组织、钎料铺展性能及Cu/Sn-0.7Cu-x Zn/Cu接头力学性能的影响。结果表明:适量Zn颗粒的添加可以细化钎料组织,减小界面IMC的厚度,提高钎料的铺展性能和硬度;过量Zn的添加则会粗化钎料组织,增大界面IMC的厚度,降低钎料的铺展性能和硬度值;接头抗拉强度随Zn的添加呈先增大后减小的趋势。当Zn含量小于0.20wt%拉伸断口类型为韧断,超过0.20wt%,拉伸断口类型为脆断。Zn的最佳添加量为0.20 wt%。
The effects of minor Zn particles on the microstmcture, spreadability of Sn-0.7Cu solder joint and mechanical properties of Cu/Sn-0.7Cu-xZrdCu joints were studied. The results show that proper amount of Zn particles can refine the microstructure of solder, decrease the IMC thickness, increase the solder spreadability and hardness. The addition of excess Zn particles can coarsen the micostructure of solder, increase the IMC thickness, decrease the solder spreadability and hardness. The tensile strength increases firstly and then decreases with the addition of Zn. When the content of Zn is less than 0.20 wt%, the tensile fracture is ductile fracture, and when it is more than 0.20wt%, the tensile fracture is brittle fracture. The optimal addition amount of Zn is 0.20 wt%.
出处
《热加工工艺》
CSCD
北大核心
2017年第23期30-34,共5页
Hot Working Technology
基金
江苏省科技计划项目(BK20141228)
