摘要
采用SEM、EDX等手段,研究了Sn58Bi-x W钎料润湿性能、组织形貌及焊点接头力学性能。结果表明:适量W颗粒可以提高Sn58Bi润湿性,随着W颗粒含量的增加,钎料的润湿性呈现先上升后下降的趋势,W质量分数为0.05%时润湿性最好,其铺展面积为132.73 mm^2。W颗粒可以有效细化Sn58Bi钎料合金的微观组织,减小焊点界面IMC厚度,当W添加量为质量分数0.1%,Sn-58B钎料的微观组织最为细小,界面IMC的厚度为0.71μm,焊点的抗拉强度最高,达101.6 MPa。
By using methods of SEM, EDX, etc., the wettability, microstructure and mechanical properties of Sn58Bi-xW solder were studied. The results show that Sn58Bi wettability can be improved by adding proper amount of W particles. With the increase of W content, the wettability of brazing filler metal increases firstly and then decreases. When the mass fraction of W is 0.05%, The wettability is the best, and its spreading area is 132.73 mm2. W-particles can effectively refine the microstructure of Sn58Bi solder alloy and reduce the thickness of IMC in the interface. When the addition amount of W is 0.1% （mass fraction）, the microstructure of Sn-58B solder is the smallest, the thickness of interface IMC is 0.71 μm, and the tensile strength of the solder joint is the highest, reaching 101.6 MPa.
出处
《电子元件与材料》
CAS
CSCD
2017年第11期78-82,共5页
Electronic Components And Materials
