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微胶囊化聚磷酸铵阻燃导热EP灌封胶的制备 被引量:5

Preparation of antiflaming and heat-conducting EP pouring sealant with microencapsulated ammonium polyphosphate
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摘要 以环氧树脂(EP)为包裹材料、聚磷酸铵(APP)高效阻燃剂为芯材,制备了微胶囊化APP;然后将微胶囊化APP和氧化铝添加到EP基体中,制备了阻燃导热EP灌封胶。研究结果表明:当w(微胶囊化APP)=30%、w(氧化铝)=150%(均相对于EP总质量而言)时,阻燃导热EP灌封胶的综合性能相对最好,其黏度(为7 800 m Pa·s)适宜、热导率[为1.15 W/(m·K)]相对较大、阻燃等级(为V-0级)相对最好、残炭率(为60.97%)相对较大且炭层致密。 With epoxy resin(EP)as encapsulating material,ammonium polyphosphate(APP)efficient fireretardant as core material,a micro-encapsulated APP was prepared. Then,an antiflaming and heat-conducting EPpouring sealant was prepared by introducing micro-encapsulated APP and alumina into EP matrix. The researchresults showed that the antiflaming and heat-conducting EP pouring sealant had the relatively best combinationproperty because its viscosity(7 800 m Pa·s)was appropriate,thermal conductivity[1.15 W/(m·K)]was relativelybiggish,antiflaming class(V-0)was relatively best,carbon residual rate(60.97%)was relatively larger,and charlayers were compact when mass fractions of micro-encapsulated APP and alumina were 30% and 150% respectivelyin total EP.
作者 靳晓雨 全国强 赵念 姜宏伟 Jin Xiaoyu Quan Guoqiang Zhao Nian Jiang Hongwei(Foshan Sanshui Jinge New Material Co., Ltd., Foshan 528131, China School of Material Science and Engineering, South China University of Science and Engineering, Guangzhou 510641, China)
出处 《中国胶粘剂》 CAS 北大核心 2017年第10期30-34,共5页 China Adhesives
关键词 灌封胶 环氧树脂 微胶囊化 阻燃 导热 pouring sealant epoxy resin (EP) micro-encapsulated antiflaming heat-conducting
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