摘要
以双酚A型环氧树脂为基料,苯酐为固化剂,咪唑类为促进剂,苄基缩水甘油醚为稀释剂,硅微粉为填充改性剂制得了性能优异的电器灌封胶。考察了硅微粉的种类及用量对环氧灌封胶的凝胶化时间,冲击强度,吸水率,体积电阻率的影响。
Epoxy encapsulating adhesive with high property were prepared using epoxy as matrix,PA as curing agent,imidazole as accelerant,benzyl glycidol ether as thinner,silica powder as the filler. The influence of the kind and using level of silica powder on the gelation time,impact strength,water absorption and volume resistivity of the epoxy encapsulating materials were studied.
出处
《化工新型材料》
CAS
CSCD
北大核心
2010年第S1期181-183,共3页
New Chemical Materials
关键词
环氧灌封胶
填料
性能
epoxy encapsulating adhesive,silica powder,property
