摘要
对超声波条件下的电镀铜和化学镀铜的结构和性能进行研究。结果表明,超声波能够提高电镀铜和化学镀铜的沉积速率,促进铜的形核过程,同时使铜晶粒表面能减小,控制晶粒的生长,使电镀铜晶层晶粒的择优取向程度更强。同时在细晶强化的作用下,提高电镀铜层的抗拉强度和伸长率。另外,超声波能减少化学镀铜层表面由于氢气泡造成的空隙。在盲孔电镀中引入超声波,可以增强盲孔内溶液的传质作用,有效提高盲孔内镀层的均匀性。
The structure and properties of copper plating and electroless copper plating under ultrasonic conditions were studied. The results show that ultrasound can increase the deposition rate of electroless copper plating and copper plating, and promote the nucleation of copper, while copper grain surface can be reduced controlling grain growth, so that the degree of preferred orientation copper plating layer crystal grains stronger, while at the fine grain strengthening effect, improve the tensile strength and elongation of the copper plating layer, in addition, ultrasound can reduce copper plating voids caused by the hydrogen bubbles. Due to the introduction of ultrasound, the mass transfer in the blind via can be enhanced, effectively improve the uniformity of the blind via plating.
出处
《电子工艺技术》
2017年第5期268-271,310,共5页
Electronics Process Technology
关键词
超声波
印制板
盲孔
电镀铜
化学镀铜
ultrasound
printed circuit board
blind via
Plating copper
Chemical copper plating
