摘要
研究电解温度,电流密度,铜离子浓度等对阴极铜质量的影响,通过目测和金相显微观察的方法对影响效果进行评价.得出的最佳工艺条件为电解温度为50℃.电流密度为200 A/m2,铜离子浓度为35-40 g/L.在该工艺条件下,得到的阴极铜表面质量平整,得到的阴极铜结晶度小,晶粒致密,择优取向不明显,表面平整光滑.
The effect of electrolytic temperature, current density and concentration of copper-ion on the surface quality of copper on cathode was investigated. The cathode was characterized by visual inspection and metallographic method. The optimum parameters for laboratory test were determined as follows, elec- trolytic temperature is 50℃, current density is 200 A/m^2, and concentration of copper-ion is 35-40 g/L. Under optimum conditions, smooth and high-purity cathode copper could be obtained.
出处
《兰州理工大学学报》
CAS
北大核心
2007年第2期9-12,共4页
Journal of Lanzhou University of Technology
基金
甘肃省自然科学基金(3ZS042-B25-029)
关键词
铜电解
表面质量
工艺
copper electrolysis
surface quality
processing
