摘要
针对间位芳纶纸在中低端应用领域性能富裕以及国产间位芳纶纸机械性能不足的问题,采用POD(聚-1,3,4-噁二唑)短切纤维和间位芳纶沉析纤维混杂制备高性能芳纶复合纸.采用扫描电子显微镜(SEM)、X射线衍射仪(XRD)分析了芳纶复合纸在不同热压温度下界面粘结性能以及结晶度的变化.阐述了热压温度对芳纶复合纸热压过程中短切纤维与沉析纤维之间的相互作用、成纸强度和电气性能的影响机理.并通过热重分析(TGA)表征芳纶复合纸的耐热性能.结果表明:当热压温度为280℃时,纸张抗张指数为95.9N·m·g^(-1),耐压强度为18.6kV·mm^(-1),结晶度为36.00%.纤维间界面粘结性能明显改善,纸张具有较优的强度性能和电气性能.芳纶复合纸初始分解温度为421.6℃,780℃时其质量损失为47.9%,芳纶复合纸具有稳定的耐热性能.
Due to the rich properties of meta-aramid paper in low-end application field and lower mechanical performance of the domestic,high performance aramid compound paper was prepared by mixing POD（poly（1,3,4-oxadiazole））chopped fibers with meta-aramid fibrids.The interfacial bonding properties of aramid compound paper and the varied crystallinity under different temperature were characterized by scanning electron microscopy（SEM）and X-ray diffraction（XRD）.The effect of hot-pressing temperature on chopped fiber and fibrids interactions,paper strength and electrical properties was clarified.The heat resistance of aramid compound paper was also examined by thermogravimetric（TGA）.The results show that;when the paper was hot pressed at 280℃（15MPa,8min）,maximum tensile index of 95.9 N·m·g^（-1）,a compressive strength of 18.6kV·mm^（-1）,crystalline of36.00%.The bonding between chopped fibers and fibrids are significantly improved,and better strength and electrical performance is shown.The aramid compound paper has good heat-resistant performance.The initial decomposition temperature is 421.6 ℃,and the mass loss is 47.9% at 780 ℃.
出处
《陕西科技大学学报（自然科学版）》
2016年第6期20-23,28,共5页
Journal of Shaanxi University of Science & Technology
基金
陕西省科技厅科技统筹创新工程计划项目(2015KTCQ01-44)
关键词
POD短切纤维
间位沉析纤维
热压
抗张强度
电气性能
POD chopped fibers
meta-aramid fibrids
hot-pressing
tensile strength
electrical property
