摘要
CCGA是在CBGA基础上发展而来,利用细长的焊柱取代焊球,借助焊柱良好的耐蠕变能力,适应PCB板与陶瓷外壳/基板之间由于热膨胀系数不同所产生的热应力失配,使得CCGA能够进行高密度、高可靠、大尺寸封装及组装。该种封装形式被广泛应用于武器装备和航空航天等领域。对CCGA用焊柱的结构、节距及生产工艺等方面的发展现状进行总结,相对于其他封装类型,CCGA封装面临成本、机械可靠性和热管理等多方面的挑战。
CCGA, evolved from CBGA, is now a high-reliability and high-density package solution of choice for military and aerospace applications. The innovative use of solder columns instead of solder balls makes best of the columns＇ creep-resistant capacities and enables a more reliable interconnection to the PCB due to reduced thermal expansion. In the article, the development of the architecture and process of solder columns are concluded. CCGA, comparing to other package solutions, is now facing more challenges including cost,mechanical reliability and thermal management.
出处
《电子与封装》
2016年第10期6-10,18,共6页
Electronics & Packaging
关键词
CCGA
焊柱
可靠性
CCGA
solder column
reliability
