摘要
将InSn49钎料与镀Au/Ni的Cu基焊盘在140℃时进行钎焊,采用扫描电镜(SEM)和能谱仪(EDS)分析研究钎料以及钎焊反应生成的金属间化合物(IMC)的成分及形貌结构。研究发现:InSn49合金钎料为两相组织,分别为富In的β相和富Sn的γ相;当钎焊温度为140℃,保温10s后,还有部分未反应完全的镀Au层,反应生成的IMC成分为AuIn_2,AuIn_2呈多面立方体结构,靠近钎料一侧的AuIn2颗粒较为粗大,分布不均匀,靠近镀Au层方向的AuIn_2颗粒较细小,分布较为致密;钎焊完成后,在靠近IMC区域的InSn49钎料存在明显的γ相偏析现象,偏析区域的γ相的厚度约为60μm。
In-49wt% Sn and Cu pad of coating Au/Ni were joined at soldering temperature of 140 ℃,chemical composition and microstructures of solder and the intermetallic compounds( IMC) were evaluated by scanning electron microscopy( SEM) and energy dispersive X-ray spectrometry( EDS). Results show that the In-49wt%Sn alloy consists of two phase,which were β phase of In-rich and γ phase of Sn-rich. At the solder temperature of 140 ℃ for 10 s,there were unreacted Au coating in the interface,the main chemical phase was AuIn_2 with faceted cubic structure,the AuIn_2 close to the solder side are coarse and uneven distribution,but that close to the Au coating side are dense fine particle. After soldering,the In-49wt% Sn solder exhibited significantly segregation of γ phase near the IMC,the depth of the γ phase was about 60 μm.
出处
《焊接》
北大核心
2016年第3期18-21,73-74,共4页
Welding & Joining
基金
浙江省科研院所专项(2016F50057)
