摘要
随着整机单位对电路尺寸及国产化的要求越来越高,数字信号处理微系统的需求显得尤为迫切。数字信号处理微系统不仅要求做到物理空间的缩小,更要保证整体性能的提升以及应用的简单化。数字信号处理微系统可以从SoC功能芯片、高可靠陶瓷/塑封基板3D-SiP封装等多个方面实现。但由于其成本高、周期长等缺点,严重影响了数字信号处理微系统的快速发展。通过设计实例,介绍了一种通过成品电路二次封装的方法,既解决了成本及周期的问题,又实现了小型化的目标。
On the increasing demand of circuit scale and localization, the requirement of DSP Microsystems is becoming instant. DSP Microsystems not only need reduction in physical space, but also promotion of function and easily applications. DSP Microsystems can be carried out by SOC IC, high-reliable ceramic/plastic 3D-SIP package. However, limited by the high cost and long period, the development ofDSP Microsystems is seriously affected. In this paper, by carrying out a design as example, a method of repackaging finished IC in introduced, which solved the problems of high cost and long period, and achieved the goal of miniaturization at the same time.
出处
《电子与封装》
2016年第2期19-22,共4页
Electronics & Packaging
