摘要
使用ANSYS有限元软件建立简化的基于硅通孔技术互连的二维结构模型,用粘塑性本构Anand方程来描述Sn Pb钎料焊点的力学行为,针对模型中的焊球进行热力耦合计算,研究热循环过程中的热失效问题。根据模拟的温度场、应力应变场找到危险焊点位置,利用修正Coffin-Manson经验方程估算危险焊点的热疲劳寿命,并且讨论了模型中通孔直径、深度和间距等参数对焊点热疲劳寿命的影响。结果表明,在只改变单一参数的情况下,焊点疲劳失效周期通孔各参量值的增加均呈现出下降的趋势,其中通孔直径和通孔间距的大小对焊点的使用寿命影响较大。
The finite element software（ FEA） ANSYS was used to establish a simplified two-dimensional model of the structure based on interconnection of through silicon via（ TSV）. The machanical behavior of Sn Pb solder was described by Anand viscoplastic constitutive equations,and the thermodynamic coupling calculation was calculated based on the solders of the model,and the thermal failure was studied in the process of the thermal cycle. According to the simulation of the temperature,stress and strain fields,the positions of dangerous solder joints were found. The thermal fatigue life of the dangerous solder joints was estimated by using the modified Coffin-Manson experience equation. The effects of the parameters（ such as the hole diameter,depth and the spacing） on thermal fatigue life of solder joints were discussed. The results show that in the case of changing single parameter value,the fatigue life of solder joints shows a downward trend with the increase of the parameters,the values of through hole diameter and spacing have great influences on service life of solder joints.
出处
《半导体技术》
CAS
CSCD
北大核心
2015年第9期684-691,共8页
Semiconductor Technology
基金
国家自然科学基金资助项目(10802015)
辽宁省高等学校杰出青年学者成长计划资助项目(LJQ2011046)
辽宁省百千万人才工程项目基金资助项目(2010921091)
关键词
硅通孔(TSV)
通孔参数
热疲劳寿命
焊点
热失效
through silicon via（TSV）
parameter of through hole
thermal fatigue life
solder joint
thermal failure
