摘要
通过赫尔槽试验和方槽试验研究了添加剂H-3、DDS和JZ-1对焦磷酸盐溶液体系电镀仿金铜锡合金性能的影响。基础镀液组成为：K4P2O7·3H2O 240 g/L,Sn2P2O7 2.0 g/L,Cu2P2O7·3H2O 24 g/L,p H 8.7。结果表明,采用焦磷酸盐溶液体系电镀铜锡合金时,只有用到添加剂方可得到仿金镀层。添加剂H-3具有一定的整平、细化晶粒和提高光亮度的作用。H-3的用量为2.8 m L/L时,在黄铜基体上获得仿金镀层的阴极电流密度范围为0.29~2.25 A/cm2。焦磷酸盐溶液体系使用添加剂H-3时,在光亮酸铜、光亮镍、无氰白铜锡中间层上和直接在钢铁基体上进行仿金电镀时,均可获得光亮的仿金镀层。
The effects of different types of additives including H-3, DDS, and JZ-1 on the performances of gold-imitative copper–tin alloy coating electroplated from an aqueous pyrophosphate electrolyte was studied in Hull cell and square cell. The plating bath （pH 8.7） is basically composed of Cu2P2O7·3H2O 24 g/L, K4P2O7·3H2O 240 g/L, and Sn2P2O7 2.0 g/L. It is shown that imitation gold coating can be obtained from the pyrophosphate electrolyte only after adding some additive to it. The additive H-3 has a certain effect of leveling, grain refinement, and brightness enhancement. The cathodic current density range for preparation of imitation gold coating on copper alloys from the electrolyte containing H-3 2.8 mL/L is 0.29-2.25 A/cm2. Bright imitation gold coatings can be obtained by conducting the electroplating process in the pyrophosphate electrolyte with additive H-3 on some intermediate layers such as bright acid copper coating, bright nickel coating, and cyanide-free white copper–tin coating or directly on steel substrate.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2015年第11期589-594,645,共6页
Electroplating & Finishing
关键词
铜锡合金
仿金
无氰电镀
焦磷酸盐
添加剂
copper-tin alloy
imitation gold
cyanide-free electroplating
pyrophosphate
additive
