摘要
综述了国内外关于电镀铜锌合金仿金工艺的现状,系统归纳含氰和无氰电镀仿金的配方。着重对无氰镀液成分、工艺流程以及后处理进行分析和比较,最后对电镀仿金工艺的发展趋势进行了展望。
The present processes for imitation gold plating of Cu Zn alloy are reviewed, and the formulas for cyanide and non cyanide imitation gold plating techniques are systematically summarized. Especially, the bath compositions, technological process and post treatment for non-cyanide imitation gold plating are analyzed and compared. Finally, the development trend of imitation gold plating processes is prospected.
出处
《电镀与环保》
CAS
CSCD
2008年第4期1-4,共4页
Electroplating & Pollution Control
关键词
仿金电镀
工艺
发展前景
imitation gold plating
proeess
development prospect
