摘要
介绍了无氰仿金镀层的种类,综述了国内外无氰仿金电镀的研究现状,包括焦磷酸盐体系、酒石酸盐体系、HEDP体系以及其他一些配位剂体系。最后对无氰仿金电镀的发展趋势进行了展望。
The sorts of non-cyanide imitation gold plating deposit are introduced. The research status of non-cyanide imitation gold plating at home and abroad is reviewed, including pyrophosphate, tartrate, HEDP and some other complexing agent systems. Finally, the development trend of non-cyanide imitation gold plating is prospected.
出处
《电镀与环保》
CAS
CSCD
北大核心
2012年第1期1-5,共5页
Electroplating & Pollution Control
