摘要
平行缝焊作为一种高可靠性的气密性密封方法,在陶瓷封装行业中有着愈发重要的应用。封焊过程中瞬间产生的高能量在完成密封的同时,会对陶瓷外壳造成很高的热应力残留,可能会对器件可靠性产生影响。介绍了平行缝焊的工作原理及工艺参数,并通过使用ANSYS软件对工艺过程中的各参数进行热仿真分析,研究平行缝焊工艺参数对陶瓷封装的热影响。
As a high reliability hermetic sealing technology, parallel seam sealing has more and more important applications in ceramic packaging industry. It will induce high residual thermal stresses by instantaneous large energy when during sealing process. And this maybe will affect the reliability of device after the subsequent test. The article introduces the theory and parallel seam sealing process parameters, and focuses on studying the thermal effects of process parameters by using the ANSYS simulation.
出处
《电子与封装》
2015年第3期1-4,17,共5页
Electronics & Packaging
关键词
平行缝焊
陶瓷封装
仿真
parallel seam sealing
ceramic packaging
simulation
