期刊文献+

管壳引脚的低应力玻璃封接

Low Stress Glass Seal for Case Pins
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摘要 针对某混合集成电路模块出现的金属引脚与管壳之间的玻璃绝缘子大量开裂失效现象,从失效模式、有限元残余应力仿真分析和理论分析角度进行了研究,同时应用了压缩型封接与匹配型封接的原理。通过工艺、材料、设计方面的优化,包括引入分步封接工艺,最终实现了玻璃绝缘子的低应力封装,大大地提高了玻璃-金属封接的可靠性。 In view of the massive cracking failure of glass insulator between metal pin and shell in a hybrid integrated circuit module,the research is carried out from the perspective of failure mode,finite element residual stress simulation analysis and theoretical analysis,and the principles of compression sealing and matching sealing are applied.Through the optimization of process,material and design,and the introduction of step sealing process,the low-stress sealing of glass insulator is finally realized,and the reliability of glass-metal sealing is greatly improved.
作者 蒋玉齐 周超杰 JIANG Yuqi;ZHOU Chaojie(Wuxi Zhongwei High-tech Electronics Co.,Ltd.,Wuxi 214035,China)
出处 《电子产品可靠性与环境试验》 2022年第3期48-54,共7页 Electronic Product Reliability and Environmental Testing
关键词 玻璃-金属封接 玻璃绝缘子 开裂失效 有限元仿真分析 改进 glass-to-metal seal glass insulator crack failure finite element analysis improvement
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