摘要
随着工业产品的小型化、轻型化、智能化的发展,对电力电子器件的封装提出了越来越高的要求,功率模块的封装已经成为电子器件轻型化、小型化发展的瓶颈。由于覆铜铝基板具有质量轻、导热好、成本低等优点,因此在功率模块的快速封装中具有较大的应用前景。重点介绍了铝基板在功率模块上的发展和优势,并通过试验对比了传统陶瓷基板,论证了新型覆铜铝基板具有优异的性能,能够满足小功率模块导热和绝缘耐压的性能要求。
With the development of industrial products which have characters of downsizing, lightness and intelligence. The package of power electronic devices become more and more important.Power module packaging has become a bottleneck of electronic devices in the light and small development.Al-based Copper Clad Laminate has the advantages of light weight, good thermal conductivity, low cost etc, So it will have wide application prospect in the rapid packaging of power modules.This paper mainly introduces the developments and advantages of aluminum substrate in the power module, and through the comparative test of traditional ceramic substrate, Al-based Copper Clad Laminate has excellent performances ,which can meet the performance requirements of thermal conductivity and Isolation Voltage in small power modules.
出处
《装备制造技术》
2015年第2期44-46,60,共4页
Equipment Manufacturing Technology
关键词
覆铜铝基板
封装
导热
功率模块
al-based copper clad laminate
package
thermal conductivity
power module
