摘要
介绍了研制出其性能达国际先进公司同类产品水平的塑封双列直插式光耦合器的工作原理和提高绝缘耐压的技术难点 ,从引线框架设计、加工精度控制、内包封材料选型、理想内包封形状控制、塑封气密性的实现。
The operation principle of molded DIP optocoupler and technical difficulties on raising the isolation voltage were introduced. From the points of view of lead frame design, processing accuracy control, inner packaging material choosing, desired inner packaging shape control, the realizing of molding air-tightness and the perfection of environmental condition, the article discussed the design and process key points on raising the isolation voltage to develop world advanced-level product and to form volume production.
出处
《液晶与显示》
CAS
CSCD
2004年第2期143-147,共5页
Chinese Journal of Liquid Crystals and Displays
