摘要
树脂塞孔工艺通常存在塞孔空洞及孔口凹陷的问题,对于POFV及叠层设计,孔口凹陷的存在会导致焊接面积变小,带来焊接可靠性的问题。文章分析了塞孔空洞的产生机理,通过实验验证,得出了产生塞孔空洞的主要影响因素,并针对性的给出了塞孔空洞的改善对策与建议。
Resin plugging process always presents inanition in the hole. Especially for the design of POFV （Plating overfilled via） and stacked via, the presence of plug dimple will cause the aperture becoming small welding area,bringing the issue of reliability of welding. In this paper, the formation principle of inanition is analyzed, the main infiuencing factors are found through experimental verification, and the improvement countermeasures for the inanition is proposed.
出处
《印制电路信息》
2014年第11期55-58,共4页
Printed Circuit Information
关键词
树脂塞孔
空洞
网印
真空塞孔
脱泡
Resin Plugging
Inanition
Screening Print
Plugged with Vacuum
Deaeration
