摘要
设计DOE试验,对高厚径比值密集盘内孔(AR≥1 0,孔心距≤0.80mm)树脂塞孔进行了研究,通过分析确定了塞孔角度是影响树脂塞满度的主要因素,并找到了高厚径比值密集盘内孔树脂塞孔的最佳工艺参数。
This paper studied on resin plugging hole of dense VIP with high aspect ratio（AR≥10,pitch≤0.80 mm） through DOE.Analysis showed that the angle of plugging hole mainly affected the resin satiation of the hole.Finally,optimum parameters were found out to plug dense VIP with high aspect ratio.
出处
《印制电路信息》
2011年第4期72-75,共4页
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