摘要
研究多芯片组件(Multi-chip Module,MCM)各元器件之间热传导的相互影响,建立了在对流空气条件下,一种基于结环热阻矩阵的MCM各元器件结温数学计算方法,并利用有限元模拟方法根据不同组合条件对结环热阻矩阵进行验证,结果表明采用结环热阻矩阵预测元器件结温的误差小于6%,说明该方法在某种程度上可运用于对流空气条件下MCM组件的热学分析技术中.
It investigated the influence of heat exchange between each chip on MCM,and presented the mathematical calculation method for the junction-temperature of MCM chips under the condition of air convection,based on junction-ambient thermal resistance matrix. Comparison between the results of ANSYS finite element simulation and calculated results via this method under different combination conditions shows that the error margin of junction-temperature forecast by junction-ambient thermal resistance matrix is less than 6%,which indicates that the junction-ambient thermal resistance matrix can be applied to heat analysis for MCM to some extent.
出处
《广东工业大学学报》
CAS
2014年第4期104-108,131,共6页
Journal of Guangdong University of Technology
基金
国家重点实验室开放基金资助项目(XF1128330)
关键词
多芯片组件
结环热阻矩阵
结温
有限元模拟
热分析
multi-chip module（MCM）
junction-ambient thermal resistance matrix
junction temperature
finite-volume method（FEM）
thermal analysis
