摘要
随着LED应用的不断发展,LED大屏控制基板的贴片工艺成为了研究热点。通过模板优化、载板优化设计、二次回流等方面的实验,研究了LED大屏控制基板高密度贴片工艺过程中如何提高焊接可靠性的问题。实验结果表明,从模板开口设计、载板治具优化设计、二次回流焊接优化设计等三方面进行工艺改善,有效地提高了LED大屏控制基板的焊接可靠性,降低了产品不良率。
With the development of LED applications, Surface Mounting Technology （SMT） of LED large screen control board has become the hot spot of research. The stencil optimization design, load board optimization design, step reflow and other aspects have been researched to improve the soldering reliability problems of SMT for high density LED large screen control substrates. The experimental results show that, the optimization proposes has improved the solder reliability of LED large screen control substrate, reduce product defective rate.
出处
《电子工艺技术》
2014年第5期277-279,共3页
Electronics Process Technology
基金
苏州市科技支撑计划项目(项目编号:SG201122)
关键词
LED
高密度
表面组装
LED
High density
Surface mounting technology
