摘要
研究了热 -力载荷下薄膜 /基板复合梁的弯曲问题 ,导出了薄膜的热膨胀系数与试样表面的温度和变形之间的关系式 ;提出一种测量导电薄膜的热膨胀系数的方法 ,并用热弯实验测 Sn O2
The bending problem of thin film/substrate composite subjected to thermal load is studied. The relation between the thermal expansion coefficient of conductive thin films, temperature and deformation of specimen surfaces is derived in this paper. Based on the findings, a method for measuring the thermal expansion coefficient of conductive thin films is developed. The thermal expansion coefficient of conductive thin films has been measured by applying the method in a thermal bend test.
出处
《复合材料学报》
EI
CAS
CSCD
北大核心
2001年第2期90-90,共1页
Acta Materiae Compositae Sinica
基金
国家自然科学基金项目 !(196 72 0 19
19972 0 2 2 )
