摘要
通过测定阴极极化曲线和循环伏安曲线,研究了焦磷酸盐溶液体系在铜电极上电沉积白铜锡的电化学行为,并分析了不同添加剂对电沉积白铜锡阴极过程和电沉积层晶相结构的影响。结果表明,焦磷酸盐溶液体系电沉积白铜锡为不可逆电极过程,溶液中Cu2+与Sn2+也有互相促进电沉积的作用。添加剂IEP、DPTHE和JZ-1都会影响溶液中Cu2+和Sn2+离子还原的阴极极化和电沉积白铜锡的晶相结构。IEP和JZ-1都具有增强Sn2+还原的阴极极化和降低Cu2+还原的阴极极化的双重作用。无添加剂和添加IEP或DPTHE的镀液中电沉积所得白铜锡的晶相结构都为Cu6Sn5,添加JZ-1的镀液中电沉积所得白铜锡的主要晶相结构则为Cu41Sn11。
The electrochemical behavior of white copper-tin electrodeposition on copper electrode from aqueous pyrophosphate bath was studied by cathodic polarization curve measurement and cyclic voltammetry. The effects of different additives on white copper-tin electrodeposition and crystal structure of the deposit were analyzed. The results showed that the electrodeposition of white copper-tin is an irreversible electrode process. Cu^2＋ and Sn^2＋ in the solution promotes the electrodeposition of each other. All of the additive IEP, DPTHE and JZ-1 affect the cathodic polarization of Cu^2＋ and Sn^2＋ reduction and the crystal structure of white copper-tin alloy deposit. Both IEP and JZ-1 have a dual function of strengthening the cathodic polarization of Sn^2＋ reduction and weakening the cathodic polarization of Cu^2＋ reduction. The crystal structure of white copper-tin alloy is Cu_6Sn_5 by electrodeposition from the baths without additive and with IEP or DPTHE, but is Cu_41Sn_11 from the bath with JZ-1.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2014年第8期317-320,共4页
Electroplating & Finishing
关键词
白铜锡合金
电沉积
焦磷酸盐
添加剂
电化学
white copper-tin alloy
electrodeposition
pyrophosphate
additive
electrochemistry
