摘要
为了探索焦磷酸盐镀铜层与铁基体结合强度差的原因,采用波谱技术,分析了纵向界面各种元素的成分变化,讨论了金属基体表面粗糙度对元素分布的影响。根据刻蚀时间可将膜层分为三部分:N,O量迅速减少的表面层,有基本固定组成的中间层和占一半厚度的出现基体元素的混合干扰层。通过对后期混合层中氧含量的分析,可得出镀铜层/铁基体界面含氧层的存在是影响电镀层与基体结合强度的主要原因的结论。
In order to explore the reason for the weak bond intensity between pyro-phosphate copper plating layer and iron substrate, spectrum technology was adopted. The compositions of various elements in the perpendicular interface were analyzed. The effect of surface roughness in the metal substrate on various elements distribution was discussed. According to etching time, the membrane layer was divided into three portions： surface layer with nitrogen and oxygen content decreasing quickly, mesosphere of basic fixed composition, and mix disturbing layer with substrate element appearing and occupying a half thickness. Through analyzing oxygen content in the mix layer, it was concluded that the oxygen layer in the interface of copper layer/iron substrate was the main cause of influencing the bond intensity between the plating layer and substrate.
出处
《光谱学与光谱分析》
SCIE
EI
CAS
CSCD
北大核心
2006年第1期166-169,共4页
Spectroscopy and Spectral Analysis
基金
国家自然科学基金(20376077
20576126)资助项目
关键词
XPS
深度刻蚀
缓蚀膜
铜/铁界面
氧分布
X-ray photoelectron spectroscopy（XPS）
Depth etching
Corrosion inhibitor membrane
Copper/iron interface
Oxygen distributing
