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TPX用于高温型合成革离型纸的研究 被引量:2

Research on the Application of TPX on Heat-Resistant Release Paper for Artificial Leather
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摘要 以耐热温度200℃以上的聚-4-甲基-1-戊烯(TPX)树脂为原料,通过热挤出涂布机淋膜复合制备离型层,探索纸膜结合强度较好时的热挤出涂布工艺条件。结果表明,采用DX820 TPX树脂为原料,挤出涂布的5段适宜温度分别为250℃、280℃、305℃、305℃和305℃,达到最佳纸膜结合强度的其他工艺条件为:螺杆转速40 r·min-1、电晕功率0.8 kW、气隙高度55 mm、压区压力700 kPa;纸膜结合强度达到0.46 kN·m-1,纸膜结合良好。 Poly(4-methyl-l-pentene) TPX resin which has high temperature over 200℃ resistance was taken as raw material to make coating by extrusion coating process. It's the first time to carry out this research in China, while this investigation is to explore the main process parameters of extrusion coating when release paper prepared has good adhesive strength of coating and base paper. It showed that when DX820 TPX was taken as raw material in this experiment, appropriate extruding temperature was 250℃,280℃, 305℃., 305℃ and 305℃, the main process parameters of extrusion coating was screw speed 40 r'min 1, corona power 0.8 kW, air gap height 55 ram, nip pressure 700 kPa so as to get good adhesive strength of coating and base paper of 0.46 kN'm 1.
出处 《纸和造纸》 北大核心 2014年第1期50-54,共5页 Paper and Paper Making
关键词 TPX树脂 纸膜结合强度 合成革离型纸 挤出涂布 TPX resin adhesive strength of coating and base paper release paper for making artificial leather extrusion coating
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  • 1须藤健一郎,川越圭生,渡边浩.脱模片以及合成皮革[P].CN1982534,2007-06-20. 被引量:1
  • 2王祖德.离型纸的制造和离型机理的初步探讨.上海造纸,1981,(1):26-26. 被引量:1
  • 3藤森尚美,世古敏也,山田胜彦.合成皮革制造用带有压纹的脱模纸及其支撑体,以及使用该脱模纸的合成皮革及其制造方法[P].CN1922007,2007-02-28. 被引量:1
  • 4我国人造革合成革行业现状及发展趋势[OL].http://www.rzghcg.com. 被引量:1
  • 5GB/T2792-1998压敏胶粘带180°剥离强度试验方法[S].北京:中国标准出版社,1998. 被引量:1
  • 6Fujimori Naomi, Seko Toshiya. Embossed release paper for synthetic leather production and support therefore, and synthetic leather using the release paper and process for producing the synthetic leather: US, 2007116929[P]. 2007-05-24. 被引量:1
  • 7Kogo Kyoko, Shiina Tokuyuki. Release sheet with emboss pattern and method for producing the same : JP, 2009-101685 [ P ]. 2009-05-14. 被引量:1
  • 8Shiina Tokuyuki, Kogo Kyoko. Embossed process release paper: JP, 2005-087322[P]. 2008-04-17. 被引量:1
  • 9Shiina Tokuyuki, Kogo Kyoko. Embossed process release paper: JP, 2008-087322[ P]. 2008-04-17. 被引量:1
  • 10Kubota Takeshi. Processing release paper: US, 6733864 [ P]. 2004-05-11. 被引量:1

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