摘要
制备了乙烯基苯基硅油、含氢硅树脂及乙烯基硅树脂,在铂催化剂的作用下,乙烯基苯基硅油、含氢硅树脂及乙烯基硅树脂按照一定比例混合后于150℃固化1h制得封装用有机硅树脂材料,并对硅树脂材料进行了红外光谱、光透过率、折射率、表观粘性、高低温稳定性及耐热性能表征。结果表明,固化制得的硅树脂材料具有高折光率(>1.54)、高透光率、良好的耐热性及热冲击稳定性,可用于LED封装材料。
The polymers of vinyl phenyl silicone oil, hydrogen-contain silicone resin and vinyl silicone resin were prepared. They were mixed with platinum catalyst and cured under 150℃ for one hour to form LED encapsulation materi- als. The characterization of the materials were researched by the FTIR, included transmittance, refraction, apparent viscosity, thermal shock stability, heat resistance and so on. The results showed that the curing silicon resin with high refraction （〉1.54）, high transmittance, high heat resistance and thermal shock stability can be used for LED encapsulation materials.
出处
《化工新型材料》
CAS
CSCD
北大核心
2013年第5期74-76,共3页
New Chemical Materials
关键词
LED封装
有机硅树脂
高折射率
耐热性
LED encapsulation, silicone resin,high refraction, heat resistance
