摘要
通过高温热氧化的方法 ,在AlN陶瓷表面形成一薄层Al2 O3作为过渡层 ,成功地将铜与AlN陶瓷键合在一起 ,研制出性能优越的AlN陶瓷覆铜基板 .研究了AlN热氧化时间及温度对键合质量的影响 ,提出了较佳的氧化工艺 ,获得的键合力可达 1 1 0N/cm .同时 ,运用扫描电镜 (SEM )、电子能谱 (EDX)对键合结构作了分析和研究 ,AlN衬底上的氧化物相对键合过程起着重要作用 .
A thick copper foil (0.3 mm) was bonded directly on an aluminum nitride substrate by heating. The AlN substrate was oxidized beforehand at high temperature. The effects of oxidation temperature and oxidation time of the AlN ceramic on bonding strength were studied, an optimum oxidation technology was put forward. The maximum bonding strength is about 110 N/cm. The adhesion strengths of the copper plates are high for samples oxidized at high temperature than those oxidized at low temperature. This is attributed to the existence of residual strains between the oxide layer and the AlN substrate. Furthermore, the bonding structure between the copper and the AlN ceramic was investigated by means of SEM and EDX. It is found that the oxide phase at AlN substrate play an important role in the bonding process.
出处
《硅酸盐学报》
EI
CAS
CSCD
北大核心
2000年第4期385-387,共3页
Journal of The Chinese Ceramic Society
