摘要
对不同形状电子元件冷却在系统中的速度场和温度场进行了模拟,建立二稳态流场及温度场模型,并运用壁面函数法进行流固边界耦合,在电子元件的散热面积为定值的条件下改变其形状,采用成熟的CFD软件进行数值求解,从而得出冷却空间二维压力场、流场及温度场分布图形。
The velocity and temperature fields of electronic components of different shapes are simulated in the cooling system with the establishment of two steady-state flow field and temperature field model.This article applies wall function method for coupled fluid-solid boundary while changing the shape under condition of the constant cooling area.Then it used sophisticated CFD software for numerical solution of two-dimensional space to arrive at cooling the pressure field, flow field and temperature degree field distribution graph.
出处
《制冷与空调（四川）》
2012年第6期575-578,共4页
Refrigeration and Air Conditioning
关键词
数值计算
压力场
速度场
温度场
numerical calculation
pressure field
velocity field
temperature field
