摘要
研究了Sn-SiC纳米复合电沉积工艺,考察了主盐浓度、甲磺酸浓度、电流密度、温度等因素对电流效率的影响规律。结果表明,当Sn2+浓度为0.18～0.24 mol/L、甲磺酸浓度为60～120 g/L、电流密度为1～3 A/dm2、温度为20～30℃时,电沉积过程中具有较高的电流效率。
A Sn-SiC nano-composite electrodeposition behavior was studied. The cvxrent efficiency of plating solution was tested during electrodeposition process. The electrodeposition behavior were investigated by the concentration of main salt, the concentration of methylsulfonic acid, current density, temperature and other factors. The results show that, when the concentration of Sn2＋ is 0.18-0.24 mol/L, the concentration of methylsulfonic acid is 60-120 g/L, current density is 1-3 A/din2 and the temperature is 20-30 C, there is a higher current efficiency in the electrodeposition process.
出处
《热加工工艺》
CSCD
北大核心
2012年第24期195-197,共3页
Hot Working Technology
基金
国家自然科学基金资助项目(50774025)
齐齐哈尔市工业攻关项目(GYGG2010-06-1)
齐齐哈尔大学青年教师科研项目(2010k-M17)
黑龙江省教育厅科研项目(12521607)
关键词
甲磺酸
锡
纳米SIC
复合电沉积
电流效率
methylsulfonic acid
tin
nano SiC
composite electrodeposition
current efficiency
