摘要
采用反应直流磁控溅射法,在硅基底上制备了一系列不同结构的Ti/TiN多层薄膜。采用X射线衍射仪(XRD)对薄膜物相进行了分析,研究了溅射沉积过程中基底温度对周期薄膜结构及内应力的影响。结果表明:多层薄膜中的Ti出现(101)面,TiN的(200)面衍射峰强度在基底温度为600℃时最高。随着衬底温度的升高,薄膜内部的压应力逐渐减小,当基底温度在600℃时,薄膜内应力最小。
A series of Ti/TiN muhilayer films was deposited on Si substrates by DC reactive magnetron sputte- ring process. The object-image and surface morphology of the films were analysed by X-ray diffraction (XRD). The influence of the sputtering substrate temperature on the intra-stress of the Ti/TiN muhilayer films was studied. The results show that: There was a Ti(100) in the multilayer films, when the substrate temperature is 600 ~C, the in- tensity of the TIN(200) was the strongest. According to the research, the intra-stress in the film decreases as the temperature increases. The intra-stress of Ti/TiN multilayer films reaches the minimum value when the substrate temperature is 600 C.
出处
《科学技术与工程》
北大核心
2012年第26期6743-6745,6749,共4页
Science Technology and Engineering
关键词
磁控溅射
多层薄膜
基底温度
薄膜内应力
magnetron sputteringof multilayer filmsmultilayer filmssputtering substrate temperature the intra-stress