摘要
HDI印制板制作中存在很多任务艺难题,重点研究了HDI板层压过程的涨缩控制及埋孔密集区域的爆板问题,并针对爆板问题提出相应的改善方法。
There are lots of problems in the production process of HDI PCB.In this article,the expansion and contraction control of PCB material in lamination process was studied.The reason of delamination in the area of densely buried via was found and the corresponding improvement was proposed.
出处
《印制电路信息》
2012年第5期50-53,共4页
Printed Circuit Information
关键词
HDI
涨缩
爆板
HDI
expansion and contraction
delamination