摘要
分析了HDI板生产中RCC料层出现孔壁爆裂的原因,同时给出了改善方法,并对此原因和改善方法进行了验证。
The paper show that one root cause of hole wall crack defect on HDI PCB, and verify this result by a series of experiment. And also the detail improvement actions are provided respectively for this defect.
出处
《印制电路信息》
2005年第5期37-41,共5页
Printed Circuit Information
