摘要
建立了复合焊点形态的能量控制方程，采用 Ｓｕｒｆａｃｅ Ｅｖｏｌｖｅｒ软件模拟了复合 ＳｎＰｂ焊点（高 Ｐｂ焊料凸点，共晶 ＳｎＰｂ焊料圆角）的形态利用复合 ＳｎＰｂ焊点形态的计算结果，采用统一型粘塑性 Ａｎａｎｄ本构方程描述复合焊点 Ｐｂ９０Ｓｎ１０和 Ｓｎ６０Ｐｂ４０的粘塑性力学行为，采用非线性有限元方法分析复合 ＳｎＰｂ焊点在热循环条件下的应力应变过程。基于 Ｃｏｆｆｉｎ—Ｍａｎｓｏｎ经验方程预测焊点的热循环寿命，考察焊点形态对焊点可靠性的影响，研究了复合
The potential energy controlling equation for SnPb solder joint geometry was investigated, and the solder joint geometry with duplicate SnPb solders in flip chip technology was simulated by Surface Evolver. Based on the unified viscoplastic Anand constitutive equation, the viscoplastic deformation behavior of SnPb solder was described. The stress and strain distributions in duplex SnPb solder joint during thermal cycle were studied by finite element method, the thermal cycle life of duplex SnPb solder joint was predicted based on Coffin--Manson equation. The solder joint geometry with duplicate SnPb solders was linked with the solder joint reliability. There exists a direct relationship between stand-off height and thermal cycle life of solder joint with duplicate SnPb solders and a regression model was carried out.
出处
《金属学报》
SCIE
EI
CAS
CSCD
北大核心
2000年第1期93-98,共6页
Acta Metallurgica Sinica
关键词
电子封装
焊点
有限元模拟
形态预测
可靠性
electronic packaging, solder joint, finite element simulation, geometry prediction, thermal cycle life, reliability
