摘要
文章采用非线性有限元方法,重点讨论了片式元件与基板的间隙对Sn-2.5Ag-0.7Cu无铅钎料焊点的应力应变分析。研究表明,在实际中适当增大间隙高度有利于改善焊点的应力分布情况。当间隙高度为0.1mm^0.2mm时,元件底部拐角处、焊根的顶部和底部以及焊趾顶部的应力值普遍较低,应力分布得到了较好的改善,这一结果对于焊点的优化及设计具有指导意义。
The analysis of stand-off height between chip component and substrate on the stress-strain distribution situation of Sn-2.SAg-0.TCu lead-free solder joint are investigated with nonlinear finite element method. The results show that properly increased the stand-offheight can be propitious to the stress distribution situation of the solder joint The equivalent stress is lower at the bottom corner of the component, the top and bottom of solder joint when stand-off height between 0. 1mm-0.2mm. The results are of importance to design and optimize of solder joint.
出处
《电子与封装》
2010年第3期1-4,共4页
Electronics & Packaging
关键词
SnAgCu系无铅钎料
间隙
应力应变
焊点可靠性
SnAgCu lead-free solder
Stand-offheight
stress-strain distribution
solder joint reliability
