摘要
在电子封装中 ,焊点失效将导致器件乃至整个系统失效 ,焊点失效的起因是焊点中热循环引起的裂纹及其扩展。从焊点的微观组织及其变化、焊点失效分析、焊点可靠性预测等方面介绍了对电子封装焊点及其可靠性研究的状况。
ELECTRONIC COMPONENTS & MATERIALS (China), Vol 19, No 2, P 24 26 (Apr 2000) In Chinese Failure of a single solder joint in an electronic package may cause the overall failure of the device, even the whole system Failures of solder joints usually result from the growth of creep/fatigue crack under thermal cycling The research of solder joints and its reliability is introduced, with respects of solder joint microstructure, failure analysis, reliability forecast, etc (12 refs )
出处
《电子元件与材料》
CAS
CSCD
2000年第2期24-26,共3页
Electronic Components And Materials
关键词
电子封装
焊点
可靠性
electronic packages
solder joints
reliability
