摘要
本文通过用于焊点形态预测软件SURFACE EVOLVER的输入数据文件,得到倒装焊焊点形态。参考模板开口指导说明(IPC-7525),拟定模板开口方案,得到相应的焊点形态。通过建立有限元模型,运用ANSYS软件对含铅焊点在热循环加载条件下的应力应变和疲劳寿命进行分析。根据预测得到的热疲劳寿命,找出了适合本文模型的模板结构参数,同时分析了其它设计与工艺参数和焊点可靠性之间的关系。
In the paper, solder joint shape is predicted through inputting data files to Surface the Flip-chip solder joints shape can stencil hatches, stencil hatch was carried formed by out. After the software. According to IPC-7525, Evolver software. Then the guidance for design building the finite element model of solder joint, stress, strain and fatigue life analysis under thermal cycle condition were analyzed using ANSYS. Based on the thermal fatigue life attained by simulation, we can find out the right configuration parameters of stencil for our model. In addition, the relationship between other design process parameters and reliability of solder joints was also analyzed.
出处
《中国集成电路》
2009年第2期42-48,共7页
China lntegrated Circuit
关键词
倒装焊
模板
焊点形态
可靠性
热疲劳寿命
Flip-chip
stencil
solder joint shape
reliability
thermal fatigue life
