摘要
研究了Ti的加入对Sn0.7Cu无铅钎料润湿性能以及钎料/Cu界面微观组织的影响。结果表明：在Sn0.7Cu中添加微量Ti,提高了钎料的润湿性能,可使铺展面积提高5%左右,当钎焊时间为3 s时,界面金属间化合物（IMC）形貌由原来的扇贝状变为锯齿状;随着钎焊时间延长,Sn0.7Cu/Cu和Sn0.7Cu0.008Ti/Cu界面IMC层厚度不断增加,其形状逐渐变为板条状,并可观察到IMC在钎料中的溶解、断裂。同等条件下,Ti的加入使界面IMC层的平均厚度减少约10%~25%;晶粒平均尺寸增加20%~75%,且钎焊时间越长,平均尺寸增加越少。
The effects on the wettability and solders/Cu interfacial microstructures of Sn0.7Cu lead-free solder by adding Ti were investigated.Results show that the wettability is improved,the spreading area is increased by 5%,the morphologies of interfacial intermetallic compound（IMC） change from scallop-shaped to serration at 3 s of soldering duration.With the increase of soldering time,the thicknesses of Sn0.7Cu/Cu and Sn0.7Cu0.008Ti/Cu interfacial IMC layers increase accordingly,the pattern of IMC changes to lath-shaped,and IMC can be observed dissolving and fracturing into solder alloys.At the same condition,with the addition of Ti,the average thickness of interfacial IMC layer reduces by 10%–25%;the average size of IMC grain increases by 20%–75%,the longer soldering time,the smaller the average size increases.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2011年第10期40-43,共4页
Electronic Components And Materials
基金
国家自然科学基金(NSFC-广东联合)重点资助项目(No.U0734006)
