期刊文献+

Cu-Ni-Si-Ag合金动态再结晶数学模型 被引量:8

Modeling of Dynamic Recrystallization in Cu-Ni-Si-Ag Alloy
下载PDF
导出
摘要 利用Gleeble-1500D热模拟试验机,采用高温等温压缩试验,对Cu-2.0Ni-0.5Si-0.15Ag合金在应变速率为0.01~5.00s-1、变形温度为600~800℃、最大变形量为80%条件下的动态再结晶行为以及组织转变进行了研究。根据σ-ε曲线确定了不同变形条件下该合金的动态再结晶体积分数,并利用该体积分数建立了合金的动态再结晶动力学数学模型。该合金动态再结晶的显微组织受变形速率的影响,动态再结晶晶粒尺寸D与Z参数满足如下关系:Ddyn=0.59×103Z-0.08。 Dynamic recrystallization behavior and microstructural evolution of Cu-2.0Ni-0.5Si-0.15Ag alloy during hot compressive deformation were investigated by isothermal compression testing at the Gleeble-1500D thermal-mechanical simulator at the temperature from 600℃ to 800℃ with strain rate from 0.01s-1 to 5s-1 under the condition of 60% strain. Recrystallized fraction at varied deformation conditions was determined based on σ-ε curves,which was employed to establish kinetic equation for dynamic recrystallization in the alloy. The dynamic recrystallized microstructure depend on the deformation strain rates. Relationship between the dynamic recrystallization grain and parameter Z is as follows: Ddyn=0.59×103Z-0.08.
出处 《特种铸造及有色合金》 CAS CSCD 北大核心 2010年第9期787-790,共4页 Special Casting & Nonferrous Alloys
基金 国家高技术研究发展计划(863计划)资助项目(2006AA03Z528) 国家自然科学基金资助项目(50571035) 河南省杰出青年基金资助项目(0521001200) 河南科技大学博士启动基金资助项目(09001414)
关键词 Cu-2.0Ni-0.5Si-0.15Ag合金 动态再结晶体积分数 动态再结晶动力学模型 动态再结晶晶粒尺寸模型 Cu-2.0Ni-0.5Si-0.15Ag Alloy,Dynamic Recrystallization Fraction,Kinetic Equation,Dynamic Recrystallization Grain Model
  • 相关文献

参考文献13

  • 1SUZUKI S, SHIBUTANI N, MIMURA K,et al. Improvement in strength and electrical conductivity of CuNiSi alloy by aging and cold rolling[J]. Journal of Alloys and Compounds, 2006,417- 116- 120. 被引量:1
  • 2ZHAO D M, DONG Q M, LIU P,et al. Structure and strength of the age hardened Cu-Ni-Si alloy[J]. Materials Chemistry and Physics, 2003,79 : 81-86. 被引量:1
  • 3王艳蕊,刘平,雷静果,康布熙,田保红.Cu-Ag-Cr合金时效特性的研究[J].特种铸造及有色合金,2005,25(8):499-501. 被引量:7
  • 4苏娟华,刘平,董企铭,李贺军,任凤章.快速凝固Cu-Cr-Sn-Zn合金的时效强化研究[J].特种铸造及有色合金,2005,25(9):572-574. 被引量:4
  • 5CORREIA J B, DAVIES H A, SELLARS C M. Strengthening in rapidly solidified age hardened Cu-Cr and Cu-Cr-Zr alloy[J]. Acta. Mater. ,1997,45(1):177-190. 被引量:1
  • 6刘平,曹兴国,康布熙,黄金亮,顾海澄.快速凝固Cu-Cr-Zr-Mg合金时效析出与再结晶的交互作用及其对性能的影响[J].功能材料,2000,31(2):167-169. 被引量:13
  • 7KIM S H, LEE D N. Annealing behavior of alumina dispersion- strengthened copper strips under different conditions [J]. Metallurgical and Materials Transactions,2002,A33(6) :1 605-1 616. 被引量:1
  • 8JONGSANG LEE, JUNG J Y,EON-SIK LEE,et al. Microstrueture and properties of titanium boride dispersed Cu alloys fabricated by spray forming [J]. Materials Science and Engineering, 2000, A277(2) : 274-283. 被引量:1
  • 9SU J H, DONG Q M, LIU P,et al. Research on aging precipitation in a Cu-Cr-Zr-Mg alloy [J]. Materials Science and Engineering, 2005, A392 (1-2) : 422-426. 被引量:1
  • 10ZHAO D M, DONG Q M, LIU P, et al. Transformation and strengthening of early stage of aging in Cu-3. 2Ni-0. 75Si alloy [J]. Transaction of Nonferrous Metal Socitty of China, 2002,12 (6):1 167-1 171. 被引量:1

二级参考文献17

共引文献20

同被引文献94

引证文献8

二级引证文献37

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部