期刊文献+

Cu-Ni-Si-Ag合金动态再结晶及组织演变 被引量:1

Dynamic recrystallization behavior and microstructure evolution of Cu-Ni-Si-Ag alloy
下载PDF
导出
摘要 在Gleeble-1500D热模拟试验机上,采用高温等温压缩试验,对Cu-2.0Ni-0.5Si-0.15Ag合金在应变速率为0.01~5s^-1变形温度为600~800℃、最大变形程度为60%条件下的流变应力行为进行了研究。分析了实验合金在高温变形时的流变应力和应变速率及变形温度之间的关系。并研究了在热压缩过程中组织的变化。结果表明:热模拟实验中,应变速率和变形温度的变化强烈地影响合金流变应力的大小,流变应力随变形温度升高而降低,随应变速率提高而增大。从流变应力、应变速率和温度的相关性,得出了该合金高温热压缩变形时的应力指数n,应力参数α,结构因子A,热变形激活能Q和流变应力方程。合金动态再结晶的显微组织强烈受到变形温度的影响。 The flow stress behavior of Cu-2.0Ni-0.5Si-0.15Ag alloy during hot compression deformation was studied by isothermal compression test at a Gleeble-1500D thermal-mechanical simulator at the temperature from 600℃ to 800℃ and at the strain rate from 0.01s^-1 to 5s^-1 under maxium strain of 60%. The relationship among the flow stress, strain rates and deformation temperatures was studied. The microstructure of the experimental alloy was studied in the process of hot-compression. The results show that the flow stress is controlled by both strain rate and deforming temperature, the flow stress decreases with the increase of deforming temperature, while increases with the increase of strain rate. Stress index n, stress scale parameter α, structural factor A, hot deformation activation energy Q, and constitutive equation were derived from the correlativity of flow stress, strain rate and temperature. Microstructure of the alloy strongly depends on deformation temperature.
出处 《材料热处理学报》 EI CAS CSCD 北大核心 2008年第3期71-75,共5页 Transactions of Materials and Heat Treatment
基金 国家高新技术研究发展计划(863计划)资助项目(2006AA03Z528) 国家自然科学基金(50571035) 河南省杰出青年基金(0521001200)
关键词 Cu-2.0Ni-0.5Si-0.15Ag合金 热压缩变形 动态再结晶 本构方程 Cu-2.0Ni-0.5Si-0.15Ag alloy hot compression deformation dynamic recrystallization constitutive equation
  • 相关文献

参考文献3

二级参考文献13

共引文献175

同被引文献10

  • 1Witusiewicz V T, Arpshofen I, Seifert H J,et al. Enthal- py of mixing of liquid and undercooled liquid ternary and quaternary Cu-Ni-Si-Zr alloys[J]. Journal of Alloys and Compounds,2002,337 : 155-167. 被引量:1
  • 2Suzuki S, Shibutani N, Mimura K,et al. Improvement in strength and electrical conductivity of CuNiSi alloy by ag-ing and cold rolling[J]. Journal of Alloys and Com- pounds,2006,417 : 116-120. 被引量:1
  • 3Lee J, Jung Y, Lee E S,et al. Microstrueture and proper ties of titanium boride dispersed Cu alloys fabricated by spray forming [J]. Materials Science and Engineering A. 2000,277(2) :274-283. 被引量:1
  • 4Sellars C M,Egart T, McG W J. La relation entre I.a re sistance et La structure dans Le deformation a chaud[J]. Mem Sci Rev Metall,1966,63: 731-746. 被引量:1
  • 5Garofalo F. An empirifcal relation refining the stress de- pendence of minimum creep rate in metals [J]. Trans Metall Soc AIME,1963,227(2):351-355. 被引量:1
  • 6Gronostajski Z. The deformation processing map for con- trol of microstructure in CuAlzFe3 aluminium bronze [J]. Journal of Materials Processing Technology, 2002, 125-126(9) : 119-124. 被引量:1
  • 7Sfinivasan N,Prasad Y V R K. Hot working characteris- tics of Nimonic 75,80A and 90 superalloys:a comparison using processing maps[J]. Journal of Materials Process- ing Technology, 1995,51:171-192. 被引量:1
  • 8谢家庆,冯发美,胡伟,毛华军,晏华,李慈.石蜡为芯材的微胶囊的直接原位聚合法制备和性能[J].功能材料,2008,39(2):293-296. 被引量:44
  • 9刘平,康布熙,曹兴国,黄金亮,殷标,顾海澄.快速凝固Cu-Cr-Zr-Mg合金的时效析出与再结晶[J].中国有色金属学报,1999,9(2):241-246. 被引量:107
  • 10雷静果,刘平,赵冬梅,康布熙,田保红.用导电率研究Cu-Ni-Si-Cr合金时效早期相变动力学[J].材料热处理学报,2003,24(4):22-26. 被引量:56

引证文献1

二级引证文献4

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部