摘要
利用磁控溅射法在单硅晶基底和玻璃基底上沉积铁氧体薄膜,采用AFM观察薄膜的微观形貌,采用划痕法测试薄膜的界面结合强度,测试结果表明:由于两种不同材质上沉积的薄膜粗糙度缘故,硅晶/铁氧体薄膜的临界载荷为19.7N,其划痕形貌为裂纹状扩展,玻璃/铁氧体薄膜的临界载荷为5.3N,其划痕形貌为剥落状。
The ferrite thin films were deposited on monocrystalline silicon and glass substrates by magnetron sputtering. Their morphologies were observed by AFM with the interfacial adhesion strength between film and substrate tested by scratch test. The results showed that because of the different surface roughnesses of the two types of substrates, the scratched crack propagates on ferrite film deposited on silicon substrate when the critical load is 19.7N, but the film deposited on glass substrate is spalled from the substrate during the scratch test when the critical load is 5.3N.
出处
《真空》
CAS
北大核心
2010年第1期43-45,共3页
Vacuum
关键词
铁氧体薄膜
界面结合强度
划痕法
ferrite film
interfacial adhesion strength
scratch test
