期刊文献+

Al_2O_3陶瓷薄片CO_2连续激光弯曲试验 被引量:9

Experiment on bending of Al_2O_3 ceramic slice with CO_2 CW-laser
下载PDF
导出
摘要 脆性材料的激光弯曲成形是激光快速成形技术的重要应用。本文通过改变激光功率、扫描速度等工艺参数,利用CO2连续激光对氧化铝陶瓷薄片进行了弯曲试验。同时,引入线能量密度来寻求适合弯曲的最佳工艺参数,并结合氧化铝陶瓷的高温性能分析了其激光弯曲特点。试验结果表明:氧化铝陶瓷在温度梯度机制下要实现激光弯曲必须使样品表面达到一定温度以降低其脆性和屈服应力,避免裂纹的产生;采用CO2连续激光可以对氧化铝陶瓷薄片进行弯曲,弯曲角度可达2°;氧化铝陶瓷的激光弯曲过程具有强烈的温度敏感性,当试样表面温度大于临界温度时,弯曲角度迅速增加;适合弯曲的最佳线能量密度为17~24 J/mm。 As an important application of laser rapid forming, the laser bending technology of brittle materials has broad prospects. In this paper,the experiments on bending of Al2O3 ceramic slices with a CO2 CW-laser are carried out at various laser processing parameters, including laser powers and scanning velocities. Laser linear energy density is introduced to explore the best processing parameters for laser bending, and bending characteristics are briefly analyzed according to the high temperature properties of Al2O3 ceramic. Experimental results show that,to realize laser bending for brittle Al2O3 at a temperature gradient, the sample surface must be heated to a specified temperature to ruduce its brittleness and yield stress and to avoid generating cracks. Moreover, the Al2O3 ceramic slice can be bent by the COs CW-laser, and the bending angle can be as high as 2° . Furthermore, the laser ben- ding processing of AlzO° ceramic slice is strongly sensitive to temperature, and there exists a critical temperature, above which, the bending angle increases greatly. The best range of laser linear energy density for bending Al2O3 ceramic is 17-24 J/mm.
出处 《光学精密工程》 EI CAS CSCD 北大核心 2009年第10期2473-2479,共7页 Optics and Precision Engineering
基金 国家教育部博士学科点专项科研基金资助项目(No.20070141002) 辽宁省自然科学基金资助项目(No.20062178)
关键词 激光弯曲 氧化铝陶瓷 温度敏感性 塑性变形 laser bending Al2O3 ceramic temperature sensitivity plastic deformation
  • 相关文献

参考文献17

  • 1管延锦,孙胜,季忠.板料激光成型技术的实验研究[J].光学技术,2000,26(3):260-262. 被引量:10
  • 2杨超君,周建忠,张永康,张.激光冲击金属板料变形的最小激光能量估算及其实验研究[J].光学精密工程,2006,14(3):396-401. 被引量:14
  • 3FRUHAUF J, GARTNER E, JANSCH E, et al..Silicon as a plastic material[J].J. Micromesh Microeng, 1999(9) :305-312. 被引量:1
  • 4LOSCHNER U, EXNER H, GANSCH E, et al.. Laser bending of silicon[J]. SPIE, 2003,4977: 86-93. 被引量:1
  • 5EXNER H,LOSCHNER U. Contactless laser bending of silicon microstructures [J]. SPIE, 2003, 5116:383-392. 被引量:1
  • 6GARTNER E, FRUHAUF J, LOSCHNER U, et al. Laser bending of etched silicon microstructure[J].Microsystem Technologies, 2001,7(1) :23-26. 被引量:1
  • 7TAM A C,POON C C, CRAWFORTH L. Laser bending of ceramics and application to manufacture magnetic head sliders in disk drives[J].Analytical Sciences, 2001,17(Special Issue) : 419-422. 被引量:1
  • 8MATSUSHITA N. Laser micro-bending for precise micro-fabrication of magnetic disk-drive components[J].SPIE,2003,5056:24-29. 被引量:1
  • 9ZHANG R X, XU X F. Microscale bending using pulsed and CW lasers [J]. SPIE, 2001,4274 : 58- 65. 被引量:1
  • 10ZHANG R X, XU X F. Microscale bending of brittle materials using pulsed and CW lasers[J].SPIE, 2002,4637 : 291-296. 被引量:1

二级参考文献59

共引文献41

同被引文献78

  • 1崔建丰,赵晶,樊仲维,赵存华,张晶,牛岗,石朝晖,裴博,张国新,薛岩,毕勇,亓岩.厚硅片的高速激光切片研究[J].光学精密工程,2006,14(5):829-834. 被引量:10
  • 2G. Dearden, S.P. Edwardson. Some recent developments in two and three dimensional laser forming for ‘macro’ and ‘micro’ applications[J]. J. Opt. A: Pure and Appl. Opt., 2003, 5(4): S8-S15. 被引量:1
  • 3Andrew C. Tam, Chie C. Poon, Linden Crawforth. Laser bending of ceramics and application to manufacture magnetic head sliders in disk drives[J]. Anal. Sci., 2001 17: S419-S421. 被引量:1
  • 4M. Naohisa. Laser micro-bending for precise micro-fabrication of magnetic disk-drive components[C]. SPIE, 2003, 5063: 24-29. 被引量:1
  • 5X. R. Zhang, X. F. Xu. Microscale bending of brittle materials using pulsed and CW lasers[C]. SPIE, 2002, 4637: 291-296. 被引量:1
  • 6X. R. Zhang, X. F. Xu. High precision micro scale bending by pulsed and CW lasers[J]. J. Manuf. Sci. E. -T. ASME, 2003, 125(3): 512-518. 被引量:1
  • 7Chihwei Chang, Churpao Kuo. An investigation of laser-assisted machining of Al2O3 ceramics planing [J]. International J. Machine Tools & Manufactures, 2007, 47(3-4): 452-461. 被引量:1
  • 8CHEN Y B,LU J,NI X W.Analysis of thermal stress damage in single-crystal silicon induced by 1064 nm long-pulse laser[J].SPIE,2007,6835:68351x. 被引量:1
  • 9YAMADA K,UEDA T,HOSOKAWA A,et al..Thermal damage of silicon wafer in thermal cleaving process with pulsed laser and CW laser[J].SPIE,2006,6107:61070H. 被引量:1
  • 10KONDRA T.Method of splitting non-metallic materials:U S,5609284[P].1997. 被引量:1

引证文献9

二级引证文献45

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部