摘要
晶体硅是当前最重要的半导体材料,主要用于微电子技术。随着微电子技术的发展,对晶圆的切割技术要求越来越高,而在实际切割中,对晶圆的切割十分注重于晶圆的切割宽度,以降低晶圆损耗。研究CO2激光切割机的脉宽、频率以及切割速度对晶圆切割宽度的影响,从而达到高效率、小宽度、高标准的激光切割加工。
Crystal silicon is the most important semiconductor material,which is mainly used in microelectronics technology. With development of microelectronics technology, the technology demanding of cutting silicon wafer is becoming increasingly. In actual operation, cutting gap width of silicon wafer is paid more attention, so as to reduce wafer loss. Pulse width of CO2 laser cutting machine ,frequency and effect of cutting speed on cutting width of silicom wafer are researched, in order to achieve high efficient, small width and high standard laser cutting.
出处
《传感器与微系统》
CSCD
北大核心
2013年第3期56-58,共3页
Transducer and Microsystem Technologies
关键词
激光切割
晶圆加工
切缝宽度
laser cutting
wafer fabrication
cutting gap width
