摘要
Sn-Cu无铅钎料具有优良的物理化学性能,研究了以柠檬酸为配位剂的电镀液中电沉积Sn-Cu薄膜。应用SEM,EDS,XRD等仪器分析手段对镀层进行了分析、表征;根据测定的阴极极化曲线对Sn-Cu电沉积机理进行了探讨。实验结果表明:电沉积能得到由Sn和Cu6Sn5两相组成、Sn的质量分数为99%的Sn-Cu膜层。
Sn-Cu lead-free solders possess excellent physical and chemical properties. Electrodeposition of tin-copper films from electrolytes with citric acid as complexant has been investigated. Scanning electron microscope （SEM）, energy dispersive X-ray spectroscopy （EDS） and X-ray diffraction （XRD） were employed to analyze and characterize the deposits, and cathodic polarization curves was applied to study the electroplating mechanism. The results show that Sn-Cu films with mass fraction of 99% Sn, composed of Sn and Cu6 Sn5 crystals, can be obtained by electrodeposition.
出处
《电镀与环保》
CAS
CSCD
北大核心
2009年第3期3-6,共4页
Electroplating & Pollution Control
关键词
电沉积
配位剂
阴极极化曲线
electrodeposition
complexant
cathodic polarization curve
