期刊文献+

超声波作用下纳米Al_2O_3粉体化学镀Cu的研究 被引量:1

Study on Nano-Al_2O_3 composite powder electroless copper plating under the Action of ultrasonic
下载PDF
导出
摘要 在超声波作用下,对100nm左右的Al2O3粉体进行化学镀铜,从化学镀铜热力学和动力学两方面对其机理进行探讨。同时借助X射线衍射判断其成分组成,用SEM观察镀覆结果,结合EDAX光电子能谱仪对其进行表面元素分析。结果表明:引入超声波可以实现纳米Al2O3粉体的化学镀铜,以EDTA-2Na为配位剂,并加入亚铁氰化钾为稳定剂,可以有效地消除或减少复合粉体中的Cu2O,可以一次镀覆得到铜含量为5%~90%的Cu—Al2O3复合粉体。 Nano- Al2O3 composite powder electroless copper plating under the Action of ultrasonic was carried on, and its mechanism was discussed from the aspect of electroless copper thermodynamics and kinetics. Its surface element was analyzed through the plating result of SEM and using X - ray photoelectron spectroscopy (XPS). The result indicated that it can realize Nano - Al2O3 composite powder electroless copper plating by introduced ultrasonic. To EDTA - 2Na for complexant and adding ferrous potassium cyanide as stabilizer, Cu2O among Composite Powder can be eliminated or reduced efficiently and Cu - Al2O3 composite powder of 5%90% content is obtained.
出处 《江西化工》 2008年第3期106-110,共5页 Jiangxi Chemical Industry
关键词 化学镀铜 纳米氧化铝 超声波 Electroless copper plating Nano- Al2O3 Ultrasonic
  • 相关文献

参考文献5

  • 1S. M. El- Raghy and A.A. Abo- Salama, The Electrochemistry of Electroless Deposition of Copper[J].J. Electrochem. Soc., 1979,126:171. 被引量:1
  • 2M. Paunovic, Potentionstatic High Overpotential Studies of Copper Deposition from Electroless Copper Solution J. Electrochem[ J]. Soc., 1985,132 : 155. 被引量:1
  • 3P. Bindra anti J. Rohlan, Mechainism of Electroless Metal plating-Mixed potential Theory and the Interdepndence of Partial Reaction[J] ,J. Appl. Electrochem., 1987, 17 : 1254 被引量:1
  • 4Mishra K. G., Paratnguru R. K. Kinetics and Mechanism of Electroless Deposition of Copper[ J] . J Eleclrochem, Soc, 1996(2) :510 - 516 被引量:1
  • 5刘国洪,匡同春,胡松青,成晓玲,向文永.超声波电镀的研究进展[J].电镀与涂饰,2006,25(3):47-50. 被引量:17

二级参考文献33

  • 1王雅琼,傅相林,许文林,李敏,张小兴.超声对铜电化学沉积速度及沉积产物结构的影响[J].过程工程学报,2004,4(4):305-309. 被引量:10
  • 2陈华茂,吴华强.超声电镀锡铋合金研究[J].表面技术,2004,33(5):52-54. 被引量:7
  • 3程敬泉,姚素薇.超声波在电化学中的应用[J].电镀与精饰,2005,27(1):16-19. 被引量:38
  • 4张勇强,卢长春.镀金用微型超声波发生器的研制和应用[J].机电元件,1994,14(2):15-17. 被引量:6
  • 5PRASAD P B S N V,AHILA A,VASUDEVAN R,et al.Corrosion resistance of zinc electrodeposits in an ultrasonically agitated bath[J].Journal of materials science letters,1993,22 (12):1752-1754. 被引量:1
  • 6MASON T J,LORMER J P.Controlling emissions from electroplating by the application of ultrasound[J].Environmental Science and Technology,2001,35 (16):3375-3377 被引量:1
  • 7SERYANOV Y V,KVYATHOVSKAYA L M,GRISHANIN V A.Optimization of Sn-Bi alloy ultra sonic electrodeposition in the narrow commutative holes of the integrated circuits[J].Zashchita metallov,1993,29(6):928 -931. 被引量:1
  • 8WALKER R.Electrodeposition of nickel-iron alloys with ultrasound[J].Plating and surface finishing,1985,72(4),68 -73. 被引量:1
  • 9RICHARDSON K A,GROOT P A J,LANCHESTER P C,et al.Towards the electrochemical manufacture of superconductor precursor films in the presence of an ultrasonic field[J].Electroanalytical Chem,1997,420(1 -2):21 -24. 被引量:1
  • 10SHADROW V G,BOLTUSHKIN A V,KOZICH N N.On magnetization reversal in hard magnetic Co-W films[J].Journal of Magnetism and Magnetic Materials,1993,118 (1/2):165-168. 被引量:1

共引文献16

同被引文献16

引证文献1

二级引证文献2

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部