摘要
采用Gleeble—3500D热模拟机,在电场和大热流密度条件下,研究了金属元素(Fe、Co和Ni)对W-20%Cu合金电场快速烧结的影响。结果表明:经800℃烧结3min,可获得晶粒较细小、显微组织较均匀的烧结体;添加金属元素能有效抑制晶粒长大。质量分数为0.35%的Fe、Ni和Co分别使其平均晶粒尺寸由1.0μm减小到0.6,0.6和0.3μm。金属元素的加入,对烧结体的致密化和硬度不利。
By using thermal simulation instrument Gleeble--3500D, the effect of metal elements （Fe, Co and Ni） on rapid sintering W-20%Cu alloy under the conditions of electric field and great thermal flow density was studied. The results show that sintered compacts with finer grains and more homogeneous microstructure can be acquired at 800℃ for 3 min under the action of electric field. The additoins of metal element can restrain effectively growth of grains. Mass fraction 0.35% Fe, Ni and Co cause the average size of grains to be decreased from 1.0 μm to 0.6, 0.6 and 0.3μm, respectively. But, adding metal elements is harmful to both densification and hardness of sintered compacts.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2008年第10期66-69,共4页
Electronic Components And Materials
基金
国家自然科学基金青年基金资助项目(No.50404014)
中国博士后科学基金资助项目(No.20060390177)
四川省学术和技术带头人培养基金资助项目(No.07SRC-08)
关键词
金属材料
W-Cu合金
电场
快速烧结
金属元素
致密化
metallic material
W-Cu alloy
electric field
rapid sintering
metal element
densification
