摘要
利用大电流电场烧结工艺在875~1000℃的烧结温度下快速制备W-Mo-Cu合金,研究烧结温度对W-Mo-Cu合金微观组织、硬度及导电性的影响。基于合金烧结过程中的尺寸变化,通过拟合计算得到烧结特征指数,从而推断W-Mo-Cu合金烧结过程中的主要迁移机制。结果表明:烧结温度为875~975℃时,随着烧结温度升高,W-Mo-Cu合金中的孔隙减少,相对密度、显微硬度及电导率提高。当烧结温度为875~925℃时,W-Mo-Cu合金的致密化主要由塑性变形而非烧结引起。当烧结温度高于925℃时,W-Mo-Cu合金致密化过程中经历的主要迁移机制依次为塑性流动、体积扩散、晶界扩散和表面扩散。
The W-Mo-Cu alloy was rapidly prepared by a large current electric field sintering method at 875-1000℃. Effect of sintering temperature on microstructure, hardness and electrical conductivity was investigated. Based on the dimensional change during alloy sintering, the sintering characteristic index was obtained by fitting calculation, and the main migration mechanism of W-Mo-Cu alloy during sintering was inferred. The results show that the pores of the W-Mo-Cu alloy decrease, the relative density, microhardness and electrical conductivity increase at the same time with the increase of sintering temperature at 875-975℃. When the sintering temperature is between 875℃ and 925℃, the densification of the alloy is mainly caused by plastic deformation instead of sintering;when the sintering temperature is higher than 925℃, the order of the main migration mechanism experienced during the densification of W-Mo-Cu alloy is plastic flow, volume diffusion, grain boundary diffusion and surface diffusion.
作者
刘艳芳
冯可芹
周虹伶
柯思璇
LIU Yan-fang;FENG Ke-qin;ZHOU Hong-ling;KE Si-xuan(School of Mechanical Engineering,Sichuan University,Chengdu 610065,China)
出处
《材料工程》
EI
CAS
CSCD
北大核心
2019年第11期135-140,共6页
Journal of Materials Engineering
基金
国家自然科学基金资助项目(51674171)
关键词
电场
W-Mo-Cu合金
烧结温度
致密化
性能
electric flied
W-Mo-Cu alloy
sintering temperature
densification
performance
